Hot melt molding device
Resins that can be used at temperatures from 120 to 250℃! Equipment design for small to large volume discharge is possible.
The "Hot Melt Molding Device" is a machine that sets the parts to be molded inside a mold and injects hot melt at low temperature and low pressure for molding. It is compatible with single-component resins such as polyamide-based, polyester-based, polyolefin-based, and moisture-curing polyurethane hot melts. It is suitable for electronic components and automotive parts. 【Features】 ■ Precise discharge using a gear pump ■ Discharge using a screw is also possible ■ Capable of discharging resins from low viscosity to high viscosity ■ Device design can accommodate both small and large discharges ■ Mold design ensures good workability *For more details, please refer to the PDF materials or feel free to contact us.
- Company：えびの興産 本社
- Price：Other
